Printed Circuit Board Raw Materials

Wherever technology takes you, Ventec delivers

About

Ventec International Group (VIG), established in 2000, is a global leader in polyimide and high-reliability epoxy laminate systems. The company operates a worldwide network of rapid-response warehouses, supported by dedicated sales and technical teams.

Ventec Americas, the North American affiliate of VIG, is committed to promoting and supporting Ventec's printed circuit board (PCB) raw materials across the United States and Canada. Ventec Americas ensures the timely distribution of top-quality raw materials to PCB fabricators throughout North America.

  • Warehousing: Climate-controlled environments for prepregs
  • Order Processing: Paneling, tooling, and packaging
  • Inventory: Large perpetual inventories in North America
  • Shipping: Fast and cost-effective shipping solutions
  • Quality Control: Rigorous quality checks to ensure the integrity and reliability of the materials

For sales inquiries, contact

SHANE STEWART

Vice President, Sales

West Coast

2730 S Main St.
Santa Ana, CA 92708

1-866-862-8749

East Coast

720 Lee St.
Elk Grove Village, IL 60007

Ventec Americas has five (5) Rapid Response Warehouses in North America

Five Rapid Response Warehouses

Products

Polyimide CCL and PPG

Superior Strength, Stability and Endurance

For high-performance substrates that can take the heat and the stress

Product Description Tg
(°C)
Td
(°C)
Z-axis CTE
(before Tg)
Z-axis CTE
(%) Total
T-300
(minutes)
Dk @ 1GHz
(RC 50%)
Df @ 1Ghz
(RC 50%)
Flammability
(UL94)
IPC-4101E
VT-901 Polyimide, non MDA 250 395 50 1.4 >30 4.05 0.012 V-0 /40/41
VT-90H Polyimide, non MDA 250 408 50 1.2 >30 4.05 0.012 HB /40/41
VT-901LF/NF Rigid Flex & Heat-Sink Prepreg 250 390 50 2.5
(RC 75%)
30 3.8 0.015 V-0 /40
VT-901HW Via hole filling (seq. lam) and thick copper 250 390 40 3.2
(RC 75%)
>30 4.3 0.016 V-0 /40/41

FR4 CCL and PPG

The backbone material PCB Designers rely on

Product Description Tg
(°C)
Td
(°C)
Z-axis CTE
(before Tg)
Z-axis CTE
(%) Total
T-300
(minutes)
Dk @ 1GHz
(RC 50%)
Df @ 1Ghz
(RC 50%)
Flammability
(UL94)
IPC-4101E
VT-47 Phenolic Cured, Lead-free 180 355 45 2.3 >60 4.27 0.016 V-0 /97/98/99/101/126
VT-47PP NF/LF No Flow/Low Flow Prepreg High Tg & Lead Free 170 360 70 - - 3.9 0.017 V-0 /97/98/99/101/126
VT-481 Phenolic Cured, Filled FR4, Mid Tg 155 345 45 2.6 >60 4.3 0.015 V-0 /97/98/99/101
VT-447(B) - BLACK Phenolic Cured, Black, Light Blocking High Tg 180 380 45 2.3 60 4.35 0.013 V-0 /127/128/130

High-Performance IMS Material (Metal Plate)

Designed for the world's most thermally demanding PCB applications

Product Thermal Conductivity
(W/mK)
Thermal Impedance
(°C*in2/W)
Dielectric Breakdown
(Volt)
Tg (DSC)
(°C)
Td (TGA)
(°C)
Dk
@ 1MHz
Df
@ 1MHz
MOT
(°C)
Flammability
(UL94)
Peel Strength - 1oz
lb/in (N/mm)
VT-4B7 7.0 0.009 3000 100 380 4.8 0.016 130 V-0 7 (1.23)
VT-4B5 4.2 0.029 7000 120 380 4.8 0.016 130 V-0 7 (1.23)
VT-4B3 3.0 0.040 7000 130 380 4.8 0.016 130 V-0 11 (1.93)
VT-5A2 (tec-thermal 5) Thermal Conductivity: 2.2 W/mK, Tg: 190°C, Td: 375°C, T260 >60 min, T288 >30min, T300 >15 min, MOT: up to 150°C V-0 6.8 (1.2)

Datasheets

Get Technical Datasheet and Process Guidelines in PDF format