Printed Circuit Board Raw Materials
Wherever technology takes you, Ventec delivers
About
Ventec International Group (VIG), established in 2000, is a global leader in polyimide and high-reliability epoxy laminate systems. The company operates a worldwide network of rapid-response warehouses, supported by dedicated sales and technical teams.
Ventec Americas, the North American affiliate of VIG, is committed to promoting and supporting Ventec's printed circuit board (PCB) raw materials across the United States and Canada. Ventec Americas ensures the timely distribution of top-quality raw materials to PCB fabricators throughout North America.
- Warehousing: Climate-controlled environments for prepregs
- Order Processing: Paneling, tooling, and packaging
- Inventory: Large perpetual inventories in North America
- Shipping: Fast and cost-effective shipping solutions
- Quality Control: Rigorous quality checks to ensure the integrity and reliability of the materials
For sales inquiries, contact
SHANE STEWART
Vice President, Sales
West Coast
2730 S Main St.
Santa Ana, CA 92708
1-866-862-8749
East Coast
720 Lee St.
Elk Grove Village, IL 60007
Ventec Americas has five (5) Rapid Response Warehouses in North America
Products
Polyimide Laminates and Prepregs
Superior Strength, Stability and Endurance
For high-performance substrates that can take the heat and the stress
| Description | Product | Tg (°C) |
Td (°C) |
Z-axis CTE (before Tg) |
Z-axis CTE (%) Total |
T-300 (minutes) |
Dk @ 1GHz (RC 50%) |
Df @ 1Ghz (RC 50%) |
Flammability (UL94) |
IPC-4101E |
|---|---|---|---|---|---|---|---|---|---|---|
| Polyimide, non MDA | VT-901 | 250 | 395 | 50 | 1.4 | >30 | 4.05 | 0.012 | V-0 | /40 /41 |
| Polyimide, non MDA | VT-90H | 250 | 408 | 50 | 1.2 | >30 | 4.05 | 0.012 | HB | /40 /41 |
| Rigid Flex & Heat-Sink Prepreg | VT-901LF/NF | 250 | 390 | 50 | 2.5 (RC 75%) |
30 | 3.8 | 0.015 | V-0 | /40 |
| Via hole filling (seq. lam) and thick copper | VT-901HW | 250 | 390 | 40 | 3.2 (RC 75%) |
>30 | 4.3 | 0.016 | V-0 | /40 /41 |
FR4 Glass-reinforced Epoxy Laminate Material
The backbone material PCB Designers rely on
| Description | Product | Tg (°C) |
Td (°C) |
Z-axis CTE (before Tg) |
Z-axis CTE (%) Total |
T-300 (minutes) |
Dk @ 1GHz (RC 50%) |
Df @ 1Ghz (RC 50%) |
Flammability (UL94) |
IPC-4101E |
|---|---|---|---|---|---|---|---|---|---|---|
| Phenolic Cured, Lead-free | VT-47 | 180 | 355 | 45 | 2.3 | >60 | 4.27 | 0.016 | V-0 | /97 /98 /99 /101 /126 |
High-Performance IMS Material Technology
Designed for the world's most thermally demanding PCB applications
| Product | Thermal Conductivity (W/mK) |
Thermal Impedance (°C*in2/W) |
Dielectric Breakdown (Volt) |
Tg (DSC) (°C) |
Td (TGA) (°C) |
Dk @ 1MHz |
Df @ 1MHz |
MOT (°C) |
Flammability (UL94) |
Peel Strength - 1oz lb/in (N/mm) |
|---|---|---|---|---|---|---|---|---|---|---|
| VT-4B7 | 7.0 | 0.009 | 3000 | 100 | 380 | 4.8 | 0.016 | 130 | V-0 | 7 (1.23) |
| VT-4B3 | 3.0 | 0.040 | 7000 | 130 | 380 | 4.8 | 0.016 | 130 | V-0 | 11 (1.93) |
| VT-5A2 (tec-thermal 5) | Thermal Conductivity: 2.2 W/mK, Tg: 190°C, Td: 375°C, T260 >60 min, T288 >30min, T300 >15 min, MOT: up to 150°C | V-0 | 6.8 (1.2) | |||||||
Datasheets
Get Technical Datasheet and Process Guidelines in PDF format
Technical Datasheets
Process Guides
Ventec International Group (VIG)
Ventec designs, develops, and manufactures high quality copper clad laminates and prepreg bonding materials for the fabrication of a wide variety of printed circuit board (PCB) applications.