Printed Circuit Board Raw Materials

Wherever technology takes you, Ventec delivers

About

Ventec International Group (VIG), established in 2000, is a global leader in polyimide and high-reliability epoxy laminate systems. The company operates a worldwide network of rapid-response warehouses, supported by dedicated sales and technical teams.

Ventec Americas, the North American affiliate of VIG, is committed to promoting and supporting Ventec's printed circuit board (PCB) raw materials across the United States and Canada. Ventec Americas ensures the timely distribution of top-quality raw materials to PCB fabricators throughout North America.

  • Warehousing: Climate-controlled environments for prepregs
  • Order Processing: Paneling, tooling, and packaging
  • Inventory: Large perpetual inventories in North America
  • Shipping: Fast and cost-effective shipping solutions
  • Quality Control: Rigorous quality checks to ensure the integrity and reliability of the materials

For sales inquiries, contact

SHANE STEWART

Vice President, Sales

West Coast

2730 S Main St.
Santa Ana, CA 92708

1-866-862-8749

East Coast

720 Lee St.
Elk Grove Village, IL 60007

Ventec Americas has five (5) Rapid Response Warehouses in North America

Five Rapid Response Warehouses

Products

Polyimide Laminates and Prepregs

Superior Strength, Stability and Endurance

For high-performance substrates that can take the heat and the stress

Description Product Tg
(°C)
Td
(°C)
Z-axis CTE
(before Tg)
Z-axis CTE
(%) Total
T-300
(minutes)
Dk @ 1GHz
(RC 50%)
Df @ 1Ghz
(RC 50%)
Flammability
(UL94)
IPC-4101E
Polyimide, non MDA VT-901 250 395 50 1.4 >30 4.05 0.012 V-0 /40 /41
Polyimide, non MDA VT-90H 250 408 50 1.2 >30 4.05 0.012 HB /40 /41
Rigid Flex & Heat-Sink Prepreg VT-901LF/NF 250 390 50 2.5
(RC 75%)
30 3.8 0.015 V-0 /40
Via hole filling (seq. lam) and thick copper VT-901HW 250 390 40 3.2
(RC 75%)
>30 4.3 0.016 V-0 /40 /41

FR4 Glass-reinforced Epoxy Laminate Material

The backbone material PCB Designers rely on

Description Product Tg
(°C)
Td
(°C)
Z-axis CTE
(before Tg)
Z-axis CTE
(%) Total
T-300
(minutes)
Dk @ 1GHz
(RC 50%)
Df @ 1Ghz
(RC 50%)
Flammability
(UL94)
IPC-4101E
Phenolic Cured, Lead-free VT-47 180 355 45 2.3 >60 4.27 0.016 V-0 /97 /98 /99 /101 /126

High-Performance IMS Material Technology

Designed for the world's most thermally demanding PCB applications

Product Thermal Conductivity
(W/mK)
Thermal Impedance
(°C*in2/W)
Dielectric Breakdown
(Volt)
Tg (DSC)
(°C)
Td (TGA)
(°C)
Dk
@ 1MHz
Df
@ 1MHz
MOT
(°C)
Flammability
(UL94)
Peel Strength - 1oz
lb/in (N/mm)
VT-4B7 7.0 0.009 3000 100 380 4.8 0.016 130 V-0 7 (1.23)
VT-4B3 3.0 0.040 7000 130 380 4.8 0.016 130 V-0 11 (1.93)
VT-5A2 (tec-thermal 5) Thermal Conductivity: 2.2 W/mK, Tg: 190°C, Td: 375°C, T260 >60 min, T288 >30min, T300 >15 min, MOT: up to 150°C V-0 6.8 (1.2)

Datasheets

Get Technical Datasheet and Process Guidelines in PDF format